Study on the Influence of Ultrafast Laser Welding Parameters on Glass Bonding Performance

Glass enjoys a wide range of applications thanks to its superior optical properties and chemical stability. Conventional glass bonding techniques suffer from low efficiency, limited precision, and high cost. Moreover, for multilayer glass bonding, repeated alignment is often required, further complicating the process. These limitations have become major constraints on the advancement of microfluidic chip technologies. Laser bonding of microfluidic chips offers high precision and efficiency. This research first uses an ultrafast laser system to investigate how processing parameters affect weld morphology, identifying the optimal parameter range. Then, this paper proposes two methods for ultrafast-laser bonding of multilayer glass with different thicknesses and performs preliminary experiments to demonstrate their feasibility. The research in this paper could expand the fabrication method of microfluidic chips and lay a foundation for the wider application of microfluidic chips.