Numerical investigation reveals that plate fin heat sinks balance heat dissipation and flow efficiency better than pin fins, indicating optimal design is crucial.
Despite advancements in cooling solutions for electronic devices, heat dissipation remains the primary challenge in optimizing heat sink performance in a competitive industry. The current study numerically investigates the performance of plate-fin heat sink (PHS) and pin-fin heat sink (PnHS) using a hybrid nanofluid (GnP-MWCNT/Water) as the working fluid. Key performance parameters, including pressure drop, thermal resistance, effectivity, and turbulent kinetic energy, are analyzed across different Re and nanofluid concentrations. Findings indicate that while the PnHS exhibits higher convective heat transfer due to increased flow disturbances, it also suffers from greater thermal resistance and pressure drop. In contrast, the PHS offers an adequate balance between heat dissipation and flow efficiency, leading to higher overall effectiveness. At Re = 5,334, the pressure drop for 0.20 % nanofluid is 88.5 Pa in the PnHS and 73 Pa in the PHS. Additionally, at Re = 1,333, the effectiveness values for PHS are 0.333 (water) and 0.354 (nanofluid), while for PnHS, they are lower at 0.186 and 0.195, respectively. The current study highlights the interplay between enhanced heat transfer and increased flow resistance, emphasizing the importance of optimizing fin design and nanofluid concentration for efficient thermal management.
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Farooq et al. (2025) studied this question.
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